Title:
RESIN COMPOSITE MATERIAL FILM AND METHOD FOR MANUFACTURING RESIN COMPOSITE MATERIAL FILM
Document Type and Number:
WIPO Patent Application WO/2023/112310
Kind Code:
A1
Abstract:
This resin composite material film includes: a plurality of resin particles that form a matrix; and a plurality of inorganic particles that are thermally conductive. The inorganic particles are anisotropic in shape and oriented in a film-thickness direction, and surface contours having a surface roughness such that the root mean square height is at least 40 μm and no more than 600 μm are formed on the surface of the film. Also provided is a method for manufacturing a resin composite material film that includes a plurality of resin particles that form a matrix and a plurality of inorganic particles that are anisotropic in shape and thermally conductive, wherein: a mixed powder that includes the plurality of resin particles and the plurality of inorganic particles is blown onto a substrate so that the inorganic particles are oriented in a film-thickness direction; and on the surface of the film, surface contours are formed, having a surface roughness such that the root mean square height is at least 40 μm and no more than 600 μm.
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Inventors:
ANDO KEISUKE (JP)
YAMAMOTO YOSHINORI (JP)
YAMAMOTO YOSHINORI (JP)
Application Number:
PCT/JP2021/046749
Publication Date:
June 22, 2023
Filing Date:
December 17, 2021
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
C08J3/20; B05D1/10; C23C24/04
Domestic Patent References:
| WO2015199244A1 | 2015-12-30 |
Foreign References:
| JP2015227497A | 2015-12-17 | |||
| JP2009006294A | 2009-01-15 | |||
| CN108720620A | 2018-11-02 | |||
| US20090202732A1 | 2009-08-13 | |||
| JP2005246193A | 2005-09-15 | |||
| JPH09314032A | 1997-12-09 | |||
| JP2006051439A | 2006-02-23 | |||
| JPH09150064A | 1997-06-10 |
Attorney, Agent or Firm:
KISA PATENT & TRADEMARK FIRM (JP)
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