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Title:
RESIN COMPOSITION FOR ACOUSTIC MATCHING LAYERS, ACOUSTIC MATCHING SHEET, ACOUSTIC WAVE PROBE, ACOUSTIC WAVE MEASUREMENT DEVICE, METHOD FOR PRODUCING ACOUSTIC WAVE PROBE, AND MATERIAL SET FOR ACOUSTIC MATCHING LAYERS
Document Type and Number:
WIPO Patent Application WO/2019/088145
Kind Code:
A1
Abstract:
A resin composition for acoustic matching layers, which contains metal particles and a binder that contains a resin, and wherein the degree of monodispersity of the metal particles as calculated by formula (1) is 40-80%; an acoustic matching sheet which uses this composition; an acoustic wave probe; an acoustic wave measurement device; and a method for producing an acoustic wave probe. A material set for acoustic matching layers, which is suitable for the preparation of the above-described composition. Formula (1): Degree of monodispersity (%) = (standard deviation of particle diameters of metal particle)/(average particle diameter of metal particles) × 100

Inventors:
HAMADA, Kazuhiro (577 Ushijima, Kaisei-machi, Ashigarakami-gu, Kanagawa 77, 〒2588577, JP)
NAKAI, Yoshihiro (577 Ushijima, Kaisei-machi, Ashigarakami-gu, Kanagawa 77, 〒2588577, JP)
Application Number:
JP2018/040438
Publication Date:
May 09, 2019
Filing Date:
October 31, 2018
Export Citation:
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Assignee:
FUJIFILM CORPORATION (26-30, Nishiazabu 2-chome Minato-k, Tokyo 20, 〒1068620, JP)
International Classes:
H04R17/00; A61B8/00; H04R31/00
Domestic Patent References:
WO2012144226A12012-10-26
WO2009113432A12009-09-17
Foreign References:
JP2006174991A2006-07-06
JP2009296055A2009-12-17
JPH03295547A1991-12-26
Attorney, Agent or Firm:
IIDA & PARTNERS et al. (ISHII Bldg. 3F, 1-10 Shimbashi 3-chome, Minato-k, Tokyo 04, 〒1050004, JP)
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