Title:
FLAME−RETARDANT HEAT−RESISTANT RESIN COMPOSITION AND ADHESIVE FILM COMPRISING THE SAME
Document Type and Number:
WIPO Patent Application WO/2003/022929
Kind Code:
A1
Abstract:
A flame−retardant heat−resistant resin composition which comprises (A) a modified polyamide−imide resin, (B) a thermosetting resin, and (C) an organophosphorus compound and which upon curing gives a film having a storage modulus of 700 MPa or lower, a coefficient of thermal expansion of 5x10−3 &sol K or lower, and an internal stress of 20 MPa or lower as measured in the temperature range of 25 to 250°C.
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Inventors:
ITOU TOSHIHIKO (JP)
TANAKA MASARU (JP)
NAKAMURA SHIGEHIRO (JP)
TANAKA MASARU (JP)
NAKAMURA SHIGEHIRO (JP)
Application Number:
PCT/JP2002/008875
Publication Date:
March 20, 2003
Filing Date:
September 02, 2002
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
ITOU TOSHIHIKO (JP)
TANAKA MASARU (JP)
NAKAMURA SHIGEHIRO (JP)
ITOU TOSHIHIKO (JP)
TANAKA MASARU (JP)
NAKAMURA SHIGEHIRO (JP)
International Classes:
C08K5/00; C08K5/523; C08L79/08; C09J7/10; C09J7/22; C09J7/35; C08L63/00; H05K3/38; (IPC1-7): C08L79/08; C09J7/02
Foreign References:
| JP2002161205A | 2002-06-04 | |||
| JP2001152016A | 2001-06-05 | |||
| JP2001139809A | 2001-05-22 | |||
| JPH11263840A | 1999-09-28 | |||
| JPH10338747A | 1998-12-22 |
Attorney, Agent or Firm:
Miyoshi, Hidekazu (Toranomon Daiichi Building 2-3, Toranomon 1-chom, Minato-ku Tokyo, JP)
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