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Patent Searching and Data


Title:
RESIN COMPOSITION AND ADHESIVE FILM, COVERLAY FILM, AND INTERLAYER ADHESIVE USING RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2014/148155
Kind Code:
A1
Abstract:
Provided are: a resin composition that can be thermally cured at 180°C or lower, the resin composition having excellent adhesive strength to substrate materials, electrical properties in the high-frequency region of a frequency of 1 GHz or higher, specifically, a low dielectric constant (ε) and a low dielectric loss tangent (tan δ) in the region of a frequency of 1 GHz or higher, as well as little shrinkage stress during thermal curing; and an adhesive film and a coverlay film produced using this resin composition. This resin composition includes (A) a vinyl compound indicated by general formula (1), (B) a polystyrene-poly(ethylene/butylene) block copolymer having a styrene content of 25-40%, (D) an epoxy resin, (E) bismaleimide, and (F) an organic peroxide having an exothermic peak measured by differential scanning calorimetry (DSC) of 100-180°C, the mass ratio of each component being (A + E)/(B + C) = 0.81-1.00, (B)/(C) = 1.00-4.00, and the resin composition containing 1-10 mass% of component (D) by mass percent in relation to the total mass of components (A)-(F) and 0.1-10 mass% of component (F) by mass percent in relation to the content of component (A).

Inventors:
TERAKI Shin (3993 Nigorikawa Kita-ku, Niigata-sh, Niigata 31, 〒9503131, JP)
KUSAMA Munetoshi (3993 Nigorikawa Kita-ku, Niigata-sh, Niigata 31, 〒9503131, JP)
YOSHIDA Masaki (3993 Nigorikawa Kita-ku, Niigata-sh, Niigata 31, 〒9503131, JP)
Application Number:
JP2014/053290
Publication Date:
September 25, 2014
Filing Date:
February 13, 2014
Export Citation:
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Assignee:
NAMICS CORPORATION (3993 Nigorikawa, Kita-ku Niigata-sh, Niigata 31, 〒9503131, JP)
International Classes:
C08L71/10; B32B27/00; B32B27/30; C08K5/14; C08K5/3415; C08L53/02; C08L63/00; C09J7/00; C09J11/06; C09J153/02; C09J163/00; C09J171/10; H05K1/03; H05K3/28; H05K3/46
Domestic Patent References:
WO2008018483A12008-02-14
WO2014024678A12014-02-13
Foreign References:
JP2011068713A2011-04-07
JP2010111758A2010-05-20
JP2012122046A2012-06-28
JP2010212291A2010-09-24
Attorney, Agent or Firm:
WATANABE Mochitoshi et al. (Yusen Iwamoto-cho Bldg. 6F, 3-3 Iwamoto-cho 2-chome, Chiyoda-k, Tokyo 32, 〒1010032, JP)
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