Title:
RESIN COMPOSITION FOR AN ADHESIVE FILM, AND ADHESIVE FILM USING SAME
Document Type and Number:
WIPO Patent Application WO/2012/134034
Kind Code:
A3
Abstract:
The present invention relates to a resin composition for an adhesive film and to an adhesive film using same. The resin composition for an adhesive film of the present invention comprises a thermoplastic resin, a thermosetting resin, a photolatent curing agent and an organic solvent. In the present invention, provided are an adhesive film and a resin composition for the adhesive film which contains a photolatent curing agent and has excellent room temperature storage properties and a quasi-limitless shelf life, and which can be cured in a short time under low temperature conditions of below 120°C and more particularly temperature conditions which are very low as compared with existing processing of below 100°C, and which ensures high reliability of the package itself and has an outstanding adhesive force.
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Inventors:
KIM IL (KR)
PAIK KYUNG-WOOK (KR)
PAIK KYUNG-WOOK (KR)
Application Number:
PCT/KR2011/009931
Publication Date:
November 15, 2012
Filing Date:
December 21, 2011
Export Citation:
Assignee:
KOREA ADVANCED INST SCI & TECH (KR)
KIM IL (KR)
PAIK KYUNG-WOOK (KR)
KIM IL (KR)
PAIK KYUNG-WOOK (KR)
International Classes:
C09J11/00; B05D5/10; C09J7/10; C09J201/00
Foreign References:
JPH08315885A | 1996-11-29 | |||
JPH09143252A | 1997-06-03 | |||
KR20100067560A | 2010-06-21 | |||
KR100934553B1 | 2009-12-29 | |||
KR100891414B1 | 2009-04-02 |
Attorney, Agent or Firm:
PARK, Young-Zoon (1719-3 Seocho3-dong Seocho-gu, Seoul 137-885, KR)
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Claims: