Title:
RESIN COMPOSITION, ADHESIVE RESIN COMPOSITION, ADHESIVE RESIN LAYER, ADHESIVE SHEET, AND ROTATING ELECTRICAL MACHINE
Document Type and Number:
WIPO Patent Application WO/2023/176958
Kind Code:
A1
Abstract:
Provided is a resin composition characterized by containing an epoxy resin, a curing agent, a foaming agent, and a filler, the shape of the filler being a flake shape, a plate shape, a needle shape, a fiber shape, or a branch shape, and when the entire resin composition excluding the solvent is defined as 100% by mass, the content of the filler is 12-80% by mass. Also provided is an adhesive sheet comprising an adhesive resin layer formed by using this resin composition.
Inventors:
LEI MING (JP)
OGINO SHOHEI (JP)
OIKAWA REI (JP)
NIWA MASASHI (JP)
KATO HAYATA (JP)
OGINO SHOHEI (JP)
OIKAWA REI (JP)
NIWA MASASHI (JP)
KATO HAYATA (JP)
Application Number:
PCT/JP2023/010579
Publication Date:
September 21, 2023
Filing Date:
March 17, 2023
Export Citation:
Assignee:
TERAOKA SEISAKUSHO KK (JP)
International Classes:
C08J9/32; C08K7/00; C08K9/10; C08L63/00; C09J7/30; C09J11/04; C09J11/06; C09J163/00; H02K1/276; H02K3/34
Domestic Patent References:
| WO2016163514A1 | 2016-10-13 | |||
| WO2013051246A1 | 2013-04-11 |
Foreign References:
| JP2007154041A | 2007-06-21 | |||
| JP2006341243A | 2006-12-21 | |||
| JP2008545039A | 2008-12-11 | |||
| JP2016046061A | 2016-04-04 | |||
| JP2013023559A | 2013-02-04 |
Attorney, Agent or Firm:
MIYAZAKI Teruo et al. (JP)
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