Title:
RESIN COMPOSITION, ADHESIVE, MULTILAYER BODY, SURFACE PROTECTION FILM, METHOD FOR PRODUCING SURFACE PROTECTION FILM, AND METHOD FOR PROTECTING SURFACE
Document Type and Number:
WIPO Patent Application WO/2022/107578
Kind Code:
A1
Abstract:
One embodiment of the present invention relates to a resin composition, an adhesive, a multilayer body, a surface protection film, a method for producing a surface protection film, or a method for protecting a surface; the resin composition contains a 4-methyl-1-pentene/α-olefin copolymer (A-1) that satisfies requirements (a) and (b), a 4-methyl-1-pentene/α-olefin copolymer (A-2) that satisfies requirements (c) and (d), and a thermoplastic resin (B) that is different from these copolymers; and relative to a total of 100% by mass of the components (A-1), (A-2) and (B), the total content of the components (A-1) and (A-2) is from 2% by mass to 50% by mass, and the content of the component (B) is from 50% by mass to 98% by mass. (a) From 65% by mole to 80% by mole of a constituent unit (i) derived from 4-methyl-1-pentene, and from 20% by mole to 35% by mole of a constituent unit (ii) derived from α-olefin are contained.
(b) The melting point as measured by DSC is less than 110°C, or alternatively, there is no measurable melting point.
(c) From 80% by mole to 90% by mole of the constituent unit (i) and from 10% by mole to 20% by mole of the constituent unit (ii) are contained.
(d) The melting point as measured by DSC is from 110°C to 160°C.
Inventors:
UEKUSA TAKAYUKI (JP)
YASUI MOTOYASU (JP)
FUKAGAWA YOSHISADA (JP)
YASUI MOTOYASU (JP)
FUKAGAWA YOSHISADA (JP)
Application Number:
PCT/JP2021/040125
Publication Date:
May 27, 2022
Filing Date:
October 29, 2021
Export Citation:
Assignee:
MITSUI CHEMICALS INC (JP)
International Classes:
B32B27/00; B29C48/21; B29C48/305; C08F210/14; C08L23/20; C08L101/00; C09J7/38; C09J123/20
Domestic Patent References:
| WO2015012274A1 | 2015-01-29 | |||
| WO2013099876A1 | 2013-07-04 | |||
| WO2016047321A1 | 2016-03-31 |
Foreign References:
| JP2014208797A | 2014-11-06 | |||
| JP2015214658A | 2015-12-03 | |||
| JP2021014531A | 2021-02-12 |
Attorney, Agent or Firm:
SSINPAT PATENT FIRM (JP)
Download PDF: