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Patent Searching and Data


Title:
RESIN COMPOSITION FOR ADHESIVE AND ADHESIVE SHEET
Document Type and Number:
WIPO Patent Application WO/2018/101460
Kind Code:
A1
Abstract:
Provided are: a resin composition for an adhesive, the resin composition having a sufficient holding force and a proper adhesive force and being capable of forming an adhesive layer that can suppress substrate staining caused by adhesive residue; and an adhesive sheet. The resin composition for an adhesive comprises a (meth) acrylic copolymer (A) that includes constituent units derived from macromonomer (a), and constituent units derived from a vinyl monomer (b), wherein: the macromonomer (a) includes two or more constituent units represented by formula (a') and is represented by formula (1); the vinyl monomer (b) includes alkyl (meth)acrylate (b1) that includes an alkyl group having 8 or more carbon atoms; and the full width half maximum X of a primary peak measured by a small-angle X-ray scattering measurement of the (meth)acrylic copolymer (A) satisfies formula (i): (i): 0 < X ≤ 0.12 (wherein , R1 denotes a hydrogen atom, a methyl group, or CH2OH; R2 denotes OR3, a halogen atom, COR4, COOR5, CN, CONR6R7, NHCOR8 or R9, Q denotes a main chain portion including two or more constituent units (a'), and Z denotes a terminal group).

Inventors:
MASUDA ERI (JP)
NAKAMURA JUNICHI (JP)
ODAKA KAZUYOSHI (JP)
SHINADA HIROKO (JP)
Application Number:
PCT/JP2017/043275
Publication Date:
June 07, 2018
Filing Date:
December 01, 2017
Export Citation:
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Assignee:
MITSUBISHI CHEM CORP (JP)
International Classes:
C09J133/04; C08F265/04; C08F290/04; C09J7/00
Foreign References:
JPH02167380A1990-06-27
Attorney, Agent or Firm:
TAZAKI Akira et al. (JP)
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