RESIN COMPOSITION AND APPLICATION THEREOF

WIPO Patent Application WO/2023/020226

A1

The present invention provides a resin composition and an application thereof, the resin composition comprising the following components by weight percentage: 15-39% cross-linkable curable resin and 61-85% filler, the filler being silicon dioxide prepared by means of organosilicon hydrolysis, the average particle diameter D50 of the silicon dioxide being 0.1-3 μm, the ratio of D100:D10 thereof being less than or equal to 2.5, and the purity of the silicon dioxide being greater than 99.9%. The resin composition of the present invention can make prepared adhesive films and resin-coated copper foils have relatively high tensile strength and peel strength, relatively good drilling processability, controllable fluidity, good filling ability, and higher electric strength, and can achieve finer line processing ability; it is a printed circuit board material applicable to multilayer laminates, especially a printed circuit board material for multilayer laminates of thin lines.

SHE NAIDONG (CN)
LIU QIANFA (CN)
HUANG ZENGBIAO (CN)
XU YONGJING (CN)
CHAI SONGGANG (CN)
ZHANG YANHUA (CN)

PCT/CN2022/108291

February 23, 2023

July 27, 2022

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SHENGYI TECHNOLOGY CO LTD (CN)

C09J163/00; B32B7/12; B32B15/14; B32B15/20; B32B17/02; B32B17/12; C09J7/30; C09J11/04; C09J157/02; C09J161/06; C09J171/12; C09J179/04; H05K1/03

CN113604182A	2021-11-05
CN109749362A	2019-05-14
US20090253851A1	2009-10-08
JP2002020113A	2002-01-23
CN102725230A	2012-10-10
CN113365943A	2021-09-07
CN101195487A	2008-06-11

BEYOND ATTORNEYS AT LAW (CN)

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