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Title:
RESIN COMPOSITION FOR BAKED PASTES, AND BAKED PASTE
Document Type and Number:
WIPO Patent Application WO/2016/132814
Kind Code:
A1
Abstract:
[Problem] The present invention addresses the problem of providing: a resin composition for baked pastes; and a baked paste which achieves a good balance between viscosity increase and pseudoplasticity, and which is adapted to various printing methods. [Solution] A resin for baked pastes, which is characterized by being obtained by blending an acidic group-containing (meth)acrylic polymer (A) and a nitrogen-containing (meth)acrylic polymer (B) so that the molar ratio of the acidic group-containing monomer to the nitrogen-containing monomer is from 5:95 to 85:15. The acidic group-containing (meth)acrylic polymer (A) is a copolymer of a monomer component containing an alkyl (meth)acrylate ester and an acidic group-containing monomer that contains a group selected from among a carboxyl group and a sulfonic acid group, and the acidic group-containing (meth)acrylic polymer (A) has a weight average molecular weight of from 10,000 to 500,000 and a glass transition temperature of 30°C or more. The nitrogen-containing (meth)acrylic polymer (B) is a copolymer of a monomer component containing a nitrogen-containing monomer and an alkyl (meth)acrylate ester, and the nitrogen-containing (meth)acrylic polymer (B) has a weight average molecular weight of from 10,000 to 500,000 and a glass transition temperature of 30°C or more.

Inventors:
MATSUMOTO, Hiroto (13-1, Hirosehigashi 1-chome, Sayama-sh, Saitama 20, 〒3501320, JP)
YABUNAKA, Shinsuke (13-1, Hirosehigashi 1-chome, Sayama-sh, Saitama 20, 〒3501320, JP)
GOTO, Shu-ichi (13-1, Hirosehigashi 1-chome, Sayama-sh, Saitama 20, 〒3501320, JP)
Application Number:
JP2016/051834
Publication Date:
August 25, 2016
Filing Date:
January 22, 2016
Export Citation:
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Assignee:
SOKEN CHEMICAL & ENGINEERING CO., LTD. (29-5, Takada 3-chome Toshima-k, Tokyo 31, 〒1718531, JP)
International Classes:
C08L33/06; C08K3/00; C08L33/02; C08L33/14; C08L35/00; C09D11/106; H01G4/12; H01G4/30
Foreign References:
JPH07238239A1995-09-12
JPH06346048A1994-12-20
JP2001089671A2001-04-03
JP2005274865A2005-10-06
JPH09111134A1997-04-28
Attorney, Agent or Firm:
SSINPAT PATENT FIRM (Gotanda Yamazaki Bldg. 6F, 13-6 Nishigotanda 7-chome, Shinagawa-k, Tokyo 31, 〒1410031, JP)
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