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Patent Searching and Data


Title:
RESIN COMPOSITION AND BONDED COMPOSITE
Document Type and Number:
WIPO Patent Application WO/2012/096136
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide: a resin composition (preferably an adhesive composition) which comprises a polyether polyamide elastomer and which can adhere strongly to a polyimide resin, preferably by simple and easy steps, to form an interface; and a bonded composite wherein the resin composition and a polyimide resin are bonded to each other with an interface formed therebetween. A resin composition which is to be made to adhere to a polyimide resin with an interface formed therebetween, wherein the resin composition comprises a polyether polyamide elastomer (R) obtained by polymerizing (A1) a specific aminocarboxylic acid compound and/or (A2) a lactam compound, (B) a polyether compound, and (C) a dicarboxylic acid compound, and the content of the elastomer (R) is 80 to 100wt%.

Inventors:
IRISA YUMA
MAEDA SHUICHI
Application Number:
PCT/JP2011/080427
Publication Date:
July 19, 2012
Filing Date:
December 28, 2011
Export Citation:
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Assignee:
UBE INDUSTRIES (JP)
IRISA YUMA
MAEDA SHUICHI
International Classes:
B32B1/08; C09J177/04; B32B27/34
Foreign References:
JP2004161964A2004-06-10
JP2003286341A2003-10-10
JPS6274640A1987-04-06
JP2002535465A2002-10-22
JPH11179850A1999-07-06
JP2000178519A2000-06-27
Attorney, Agent or Firm:
TSUKUNI, HAJIME (JP)
Hajime Tsukuni (JP)
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Claims: