Title:
RESIN COMPOSITION FOR CIRCUIT BOARD, AND METAL-BASE CIRCUIT BOARD IN WHICH SAME IS USED
Document Type and Number:
WIPO Patent Application WO/2018/173945
Kind Code:
A1
Abstract:
Provided are: a metal-base circuit board having exceptional solder crack resistance, thermal conductivity, adhesiveness, and insulating properties; and a resin composition for a circuit board used for said metal-base circuit board. The resin composition for a circuit board containing: a vinylsilyl-group-containing polysiloxane (vinylsilyl group equivalent: 0.005-0.045 mol/kg) including (A) a double-terminal vinylsilyl-group-containing polysiloxane having a weight-average molecular weight of 30,000-80,000, and (B) a side-chain double-terminal vinylsilyl-group-containing polysiloxane having a weight-average molecular weight of 100,000 or greater; a hydrosilyl-group-containing polysiloxane (hydrosilyl group equivalent: 6 mol/kg or greater); and 60-80 vol% of an inorganic filler. The mass ratio of (A) to (B) ((A)/(B)) is 80/20 to 30/70, and the molar ratio of (C) hydrosilyl groups to (D) vinylsilyl groups ((C)/(D)) is 2.5-5.0.
Inventors:
NISHI TAIKI (JP)
YASHIMA KATSUNORI (JP)
KIMOTO YUKI (JP)
SUYAMA IKUO (JP)
KOGURE KATSUMICHI (JP)
YASHIMA KATSUNORI (JP)
KIMOTO YUKI (JP)
SUYAMA IKUO (JP)
KOGURE KATSUMICHI (JP)
Application Number:
PCT/JP2018/010424
Publication Date:
September 27, 2018
Filing Date:
March 16, 2018
Export Citation:
Assignee:
DENKA COMPANY LTD (JP)
International Classes:
H05K1/05; B32B15/08; B32B27/20; C08K3/00; C08K3/28; C08L83/05; C08L83/07; H01L23/14; H01L23/36; H01L23/373; H05K1/03
Foreign References:
| JP2013203874A | 2013-10-07 | |||
| JP2009056791A | 2009-03-19 | |||
| JP2016079320A | 2016-05-16 | |||
| JP2009235368A | 2009-10-15 | |||
| JP2013023603A | 2013-02-04 |
Attorney, Agent or Firm:
WATANABE Kaoru (JP)
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