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Title:
RESIN COMPOSITION FOR CLEANING DIE
Document Type and Number:
WIPO Patent Application WO/2013/111709
Kind Code:
A1
Abstract:
The present invention provides a resin composition for cleaning dies, which contains a melamine resin, a spherical inorganic filler that has a maximum particle diameter of 1-70 μm, a curing catalyst that is selected from among myristic acid and stearic acid, and zinc myristate that is a salt of a saturated fatty acid and a metal.

Inventors:
NOMURA HIROAKI (JP)
YOSHIMURA KATSUNORI (JP)
SATO TAICHI (JP)
Application Number:
PCT/JP2013/051107
Publication Date:
August 01, 2013
Filing Date:
January 21, 2013
Export Citation:
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Assignee:
NIPPON CARBIDE KOGYO KK (JP)
International Classes:
B29C33/72; C08K5/098; C08K7/18; C08L61/28
Domestic Patent References:
WO2002030648A12002-04-18
WO2013011876A12013-01-24
Foreign References:
JPH0857865A1996-03-05
JP2002160225A2002-06-04
JP2002128988A2002-05-09
Attorney, Agent or Firm:
NAKAJIMA, Jun et al. (JP)
Nakajima 淳 (JP)
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