Title:
RESIN COMPOSITION FOR CLEANING MOLD
Document Type and Number:
WIPO Patent Application WO/2002/090077
Kind Code:
A1
Abstract:
A resin composition for cleaning a mold which removes stains adhered on the surface of a mold during the molding of a curable resin material, characterized in that it comprises a melamine resin as a mold cleaning resin, at least one guanamine and/or at least one guanamine resin, and a fibrous inorganic compound having an average fiber length of 5 to 30 $g(m)m, an average fiber diameter of 0.1 to 1.0 $g(m)m and an aspect ratio of 10 to 60.
Inventors:
HIROMITSU KIYOHITO
SASAYAMA MITSUYOSHI
NOMURA HIROAKI
SASAYAMA MITSUYOSHI
NOMURA HIROAKI
Application Number:
PCT/JP2002/002600
Publication Date:
November 14, 2002
Filing Date:
March 19, 2002
Export Citation:
Assignee:
NIPPON CARBIDE KOGYO KK (JP)
International Classes:
B29C33/72; C11D3/37; C11D7/02; C11D7/32; C11D11/00; (IPC1-7): B29C33/72
Domestic Patent References:
| WO2002030648A1 | 2002-04-18 |
Foreign References:
| GB2298650A | 1996-09-11 | |||
| JPS59126426A | 1984-07-21 | |||
| JPH07292262A | 1995-11-07 | |||
| JPS55113517A | 1980-09-02 | |||
| JPH0957762A | 1997-03-04 | |||
| JPH0857866A | 1996-03-05 |
Attorney, Agent or Firm:
Hatori, Osamu (Akasaka 1-chome Minato-ku, Tokyo, JP)
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