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Title:
RESIN COMPOSITION FOR COMPOSITE DIELECTRIC BODY, COMPOSITE DIELECTRIC BODY, AND ELECTRICAL CIRCUIT BOARD USING SUCH COMPOSITE DIELECTRIC BODY
Document Type and Number:
WIPO Patent Application WO/2005/033209
Kind Code:
A1
Abstract:
Disclosed is a liquid composition for organic-inorganic composite dielectric bodies wherein inorganic dielectric material is excellently dispersed in an organic polymer. An organic-inorganic composite dielectric body made from this liquid composition has a high dielectric constant. The liquid composition for composite dielectric bodies contains an inorganic dielectric material and a fluorinated aromatic polymer. Also disclosed are a composite dielectric body obtained by using such a liquid composition for composite dielectric bodies, and an electrical circuit board comprising such a composite dielectric body as a component.

Inventors:
YAMASAKI HAYAHIDE (JP)
ASAKO YOSHINOBU (JP)
OMOTE KAZUSHI (JP)
NISHICHI AI (JP)
Application Number:
PCT/JP2004/013764
Publication Date:
April 14, 2005
Filing Date:
September 21, 2004
Export Citation:
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Assignee:
NIPPON CATALYTIC CHEM IND (JP)
YAMASAKI HAYAHIDE (JP)
ASAKO YOSHINOBU (JP)
OMOTE KAZUSHI (JP)
NISHICHI AI (JP)
International Classes:
C08K3/10; C08L101/04; H01G4/20; H01L51/05; H05K1/16; (IPC1-7): C08L101/04
Foreign References:
JP2002060595A2002-02-26
JPH02225358A1990-09-07
JPH0594717A1993-04-16
JPH05128912A1993-05-25
JP2002344100A2002-11-29
JPH05506042A1993-09-02
JPH05503112A1993-05-27
Attorney, Agent or Firm:
Yasutomi, Yasuo (4-20 Nishinakajima 5-chome, Yodogawa-k, Osaka-shi Osaka 11, JP)
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