Title:
RESIN COMPOSITION CONTAINING HOLLOW PARTICLES, PREPREG CONTAINING SUCH COMPOSITION AND LAMINATED SHEET
Document Type and Number:
WIPO Patent Application WO/2004/067638
Kind Code:
A1
Abstract:
A resin composition is disclosed which enables to stably produce a laminated sheet that has a low dielectric constant, low dielectric loss tangent, and low thermal expansion coefficient. The resin composition contains a thermosetting resin and hollow particles. The shells of the hollow particles have a single layer structure composed of a polymer or copolymer of a crosslinking monomer, or a copolymer of a crosslinking monomer and a monofunctional monomer. The hollow particles have an average particle diameter of 0.1-30 μm and a shell thickness of 0.01-4 μm. The volume ratio of the internal void to the total volume in the hollow particles is 40-80%.
Inventors:
INOUE HIROHARU (JP)
SAITO EIICHIRO (JP)
FUJIWARA HIROAKI (JP)
OKUBO MASAYOSHI (JP)
SAITO EIICHIRO (JP)
FUJIWARA HIROAKI (JP)
OKUBO MASAYOSHI (JP)
Application Number:
PCT/JP2004/000725
Publication Date:
August 12, 2004
Filing Date:
January 27, 2004
Export Citation:
Assignee:
MATSUSHITA ELECTRIC WORKS LTD (JP)
NEW IND RES ORGANIZATION (JP)
INOUE HIROHARU (JP)
SAITO EIICHIRO (JP)
FUJIWARA HIROAKI (JP)
OKUBO MASAYOSHI (JP)
NEW IND RES ORGANIZATION (JP)
INOUE HIROHARU (JP)
SAITO EIICHIRO (JP)
FUJIWARA HIROAKI (JP)
OKUBO MASAYOSHI (JP)
International Classes:
C08J5/24; C08J9/32; C08L101/00; H05K1/03; (IPC1-7): C08L101/00; C08J5/24
Foreign References:
| JP2003213016A | 2003-07-30 | |||
| JPH06345943A | 1994-12-20 | |||
| JPH04178439A | 1992-06-25 | |||
| JPS62127336A | 1987-06-09 |
Attorney, Agent or Firm:
Nishikawa, Yoshikiyo c/o Hokuto, Patent Attorneys Office (Umeda-Daiichiseimei Bldg. 5th Floor 12-17,
Umeda 1-chome, Kita-k, Osaka-shi Osaka 01, JP)
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