Title:
RESIN COMPOSITION, COPPER FOIL WITH RESIN, AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2024/034463
Kind Code:
A1
Abstract:
Provided is a resin composition that not only exhibits high adhesiveness against less rough surfaces and has excellent dielectric properties, but also can stably sustain the high adhesiveness even after a heat load is applied thereto. The resin composition contains: an arylene ether compound having a weight average molecular weight of 30000 or more, and/or a styrene-based copolymer that has, within the molecule, a reactive unsaturated bond that expresses reactivity due to heat or ultraviolet rays; and an organic filler formed of a liquid crystal polymer.
Inventors:
OSAWA KAZUHIRO (JP)
OGAWA KUNIHARU (JP)
MAKINO HARUKA (JP)
TAMURA AKINORI (JP)
TATEOKA AYUMU (TW)
OGAWA KUNIHARU (JP)
MAKINO HARUKA (JP)
TAMURA AKINORI (JP)
TATEOKA AYUMU (TW)
Application Number:
PCT/JP2023/028105
Publication Date:
February 15, 2024
Filing Date:
August 01, 2023
Export Citation:
Assignee:
MITSUI MINING & SMELTING CO LTD (JP)
International Classes:
B32B15/08; C08F299/00; B32B15/082; C08L25/08; C08L53/02; C08L67/00; C08L71/12; H05K1/03
Domestic Patent References:
| WO2017150336A1 | 2017-09-08 | |||
| WO2005073264A1 | 2005-08-11 |
Foreign References:
| JP2002317111A | 2002-10-31 | |||
| JP2002069290A | 2002-03-08 | |||
| JP2002121377A | 2002-04-23 | |||
| JP2006232952A | 2006-09-07 | |||
| US20140187674A1 | 2014-07-03 | |||
| JPH1192566A | 1999-04-06 | |||
| JP2002502678A | 2002-01-29 | |||
| CN107964203A | 2018-04-27 |
Attorney, Agent or Firm:
TAKAMURA Masaharu et al. (JP)
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