Title:
RESIN COMPOSITION, COVER TAPE, AND ELECTRONIC COMPONENT PACKAGE
Document Type and Number:
WIPO Patent Application WO/2018/061442
Kind Code:
A1
Abstract:
The resin composition according to the present invention is a resin composition that constitutes a sealant layer provided on one surface side of a cover tape that seals a carrier tape having a depression that can accommodate an electronic component. The resin composition according to the present invention comprises (A) a polyolefin resin, (B) an antistatic agent, and at least one of (C) a polystyrene resin and (D) a (meth)acrylate ester polymer. The polyolefin resin (A) contains a structural unit I derived from a carboxylic acid or a carboxylic acid derivative, and the proportion for the structural unit I derived from a carboxylic acid or a carboxylic acid derivative is 1-5 mass% inclusive with reference to the total amount of the polyolefin resin (A). The total content of the polystyrene resin (C) and (meth)acrylate ester polymer (D) is 3-65 parts by mass inclusive per 100 parts by mass of the resin composition.
Inventors:
ABE HIROKI (JP)
Application Number:
PCT/JP2017/027195
Publication Date:
April 05, 2018
Filing Date:
July 27, 2017
Export Citation:
Assignee:
SUMITOMO BAKELITE CO (JP)
International Classes:
C08L23/26; B65D85/86; C08L23/08; C08L25/04; C08L33/06
Domestic Patent References:
| WO2012133284A1 | 2012-10-04 |
Foreign References:
| JP2012188509A | 2012-10-04 | |||
| JP2011063662A | 2011-03-31 | |||
| JPS5815545A | 1983-01-28 | |||
| JP2001019810A | 2001-01-23 |
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
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