Title:
RESIN COMPOSITION, COVERLAY FILM USING SAME, ADHESIVE SHEET, RESIN-ATTACHED METAL FOIL, METAL CLAD LAMINATE, OR PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2023/100499
Kind Code:
A1
Abstract:
Provided are: a coverlay which has excellent resin flow characteristics during secondary processing; an adhesive sheet; and a circuit board using same. The present invention pertains to a resin composition used for an adhesive layer of a laminated substrate. The resin composition is characterized in that the average value of the maximum length (that is, the amount of secondary resin flow) of a resin flowing out from the outer periphery of a specimen heated and pressed in the thickness direction under the conditions of 160°C, 2 MPa, and 30 minutes is less than 0.15 mm, wherein the specimen is prepared by sandwiching a completely cured 25 μm-thick sheet between same-shaped 125 μm-thick polyimide films to form a laminate and then punching the laminate to obtain a disk-shaped specimen.
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Inventors:
OKABE SHUNYA (JP)
HAYASHI NAOKI (JP)
SHIMOKAWAJI TOMOHIRO (JP)
HAYASHI NAOKI (JP)
SHIMOKAWAJI TOMOHIRO (JP)
Application Number:
PCT/JP2022/038395
Publication Date:
June 08, 2023
Filing Date:
October 14, 2022
Export Citation:
Assignee:
NIKKAN IND (JP)
International Classes:
B32B27/38; C09J7/30; C09J123/10; C09J163/00; C09J201/00; H05K1/03
Domestic Patent References:
| WO2011068157A1 | 2011-06-09 | |||
| WO2008004399A1 | 2008-01-10 | |||
| WO2016047289A1 | 2016-03-31 | |||
| WO2018116967A1 | 2018-06-28 | |||
| WO2019172109A1 | 2019-09-12 |
Foreign References:
| JP2005247953A | 2005-09-15 | |||
| JP2021025016A | 2021-02-22 |
Attorney, Agent or Firm:
NISHIMURA, Ryuhei et al. (JP)
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