Title:
RESIN COMPOSITION, CURED ARTICLE, LAMINATE, METHOD FOR PRODUCING CURED ARTICLE, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/210225
Kind Code:
A1
Abstract:
Provided are: a resin composition including a cyclized resin or a resin that is a precursor thereof, and also including a compound B represented by formula (1-1); a cured article obtained by curing the resin composition; a laminate including the cured article; a method for producing the cured article; and a semiconductor device including the cured article or the laminate. X1 represents an n-valent linking group including an aromatic ring structure, at least one binding site with nitrogen atoms in the formula in X1 being an aromatic ring structure. R1 each independently represent a hydrogen atom or a monovalent organic group, it being permissible for R1 to bond with X1 to form a ring structure. Y1 each independently represent an m+1-valent linking group. W1 each independently represent a group including a polymerizable group. n represents an integer equal to or greater than 1, and m represents an integer equal to or greater than 1.
Inventors:
NOZAKI ATSUYASU (JP)
Application Number:
PCT/JP2022/013773
Publication Date:
October 06, 2022
Filing Date:
March 24, 2022
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
C08F283/04; B32B15/08; C08F2/44; C08F290/14; C08G59/40; C08K5/20; C08L79/04; C08L79/08; G03F7/027; G03F7/20; G03F7/40; H05K1/03
Foreign References:
| JP2012162725A | 2012-08-30 | |||
| JP2005091399A | 2005-04-07 | |||
| JPS6440513A | 1989-02-10 | |||
| JPH02157845A | 1990-06-18 | |||
| JPH02154260A | 1990-06-13 | |||
| JP2013050696A | 2013-03-14 | |||
| KR20110111640A | 2011-10-12 |
Other References:
YEGANEH HAMID, PEJMAN HOJATI TALEMI, SADEGH JAMSHIDI: "Novel Method for Preparation of Polyurethane Elastomers with Improved Thermal Stability and Electrical Insulating Properties", JOURNAL OF APPLIED POLYMER SCIENCE, vol. 103, no. 3, 8 November 2006 (2006-11-08), pages 1776 - 1785, XP055971953, DOI: 0.1002/app.25075
Attorney, Agent or Firm:
SIKS & CO. (JP)
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