Title:
RESIN COMPOSITION, CURED ARTICLE, LAYERED BODY, CURED ARTICLE PRODUCTION METHOD, LAYERED BODY PRODUCTION METHOD, SEMICONDUCTOR DEVICE PRODUCTION METHOD, SEMICONDUCTOR DEVICE, AND BASE GENERATING AGENT
Document Type and Number:
WIPO Patent Application WO/2023/026892
Kind Code:
A1
Abstract:
Provided are: a resin composition that can produce a cured article having excellent pattern rectangularity; a cured article obtained by curing the resin composition; a layered body including the cured article; a method for producing a cured article; a method for producing a layered body; a method for producing a semiconductor device, which includes a method for producing a layered body; and a semiconductor device that includes a cured article or a layered body. Also provided is a novel base generating agent. The resin composition comprises a resin, a base generating agent and a photosensitizing agent. The base generating agent has at least two amide groups that bond to a specific organic group. The base generating agent does not include an ethylenic unsaturated bond in which one end of the bond is directly bonded to an aromatic ring and the other end is directly bonded to a carbonyl group in an amide group.
Inventors:
ASAKAWA DAISUKE (JP)
Application Number:
PCT/JP2022/030902
Publication Date:
March 02, 2023
Filing Date:
August 15, 2022
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/004; C09K3/00; G03F7/027; G03F7/038; G03F7/039; H01L21/312
Domestic Patent References:
| WO2020066315A1 | 2020-04-02 | |||
| WO2020066416A1 | 2020-04-02 |
Attorney, Agent or Firm:
YONEKURA Junzo et al. (JP)
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