Title:
RESIN COMPOSITION, CURED FILM, INSULATING FILM OR PROTECTIVE FILM, ANTENNA ELEMENT, ELECTRONIC COMPONENT, DISPLAY DEVICE OR SEMICONDUCTOR DEVICE, AND PRODUCTION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2022/102345
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide: a resin composition which, even after a package reliability test, does not exhibit a decrease in elongation and has high cracking resistance; a cured film, insulating film, or protective film obtained from said resin composition; an electronic component; a display device; a semiconductor device; and a production method therefor. In order to solve the above problem, a resin composition according to the present invention comprises a resin (A) and a solvent (E), wherein the resin (A) includes at least one substance selected from the group consisting of polyimides, polyamides, polybenzoxazole, precursors of these, and copolymers of these, and the resin (A) has a structure represented by formula (1).
Inventors:
SHOJI YU (JP)
ARAKI HITOSHI (JP)
TOMIKAWA MASAO (JP)
OGASAWARA HISASHI (JP)
ARAKI HITOSHI (JP)
TOMIKAWA MASAO (JP)
OGASAWARA HISASHI (JP)
Application Number:
PCT/JP2021/038380
Publication Date:
May 19, 2022
Filing Date:
October 18, 2021
Export Citation:
Assignee:
TORAY INDUSTRIES (JP)
International Classes:
C08G69/00; C08G73/10; C08G73/22; C08L79/00; G03F7/004; G03F7/023; G03F7/20
Foreign References:
| JP2001237241A | 2001-08-31 | |||
| JPH04306241A | 1992-10-29 | |||
| JPH04288344A | 1992-10-13 | |||
| JP6293159B2 | 2018-03-14 | |||
| US4760126A | 1988-07-26 | |||
| JP2001254014A | 2001-09-18 | |||
| JP2020066651A | 2020-04-30 |
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