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Patent Searching and Data


Title:
RESIN COMPOSITION, CURED FILM, PRINTED WIRING BOARD WITH CURED FILM, AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2020/080352
Kind Code:
A1
Abstract:
This resin composition includes a binder resin (a), a thermosetting resin (b), and a flame retardant (c). The binder resin (a) is a polymer having a urethane bond in a molecule, and may also have a carboxy group and/or a photopolymerizable functional group. The flame retardant (c) is an organic phosphorus compound represented by the general formula. In the formula, R2 and R5 are each independently a phenyl group which may have a substituent, a naphthyl group which may have a substituent, or an anthryl group which may have a substituent; R1, R3, R4, and R6 are each independently a hydrogen atom, an alkyl group having 1-4 carbon atoms, a phenyl group which may have a substituent, a naphthyl group which may have a substituent, or an anthryl group which may have a substituent.

Inventors:
MATSUNAGA HIROKI (JP)
KIDO MASAYOSHI (JP)
KOGISO TETSUYA (JP)
Application Number:
PCT/JP2019/040438
Publication Date:
April 23, 2020
Filing Date:
October 15, 2019
Export Citation:
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Assignee:
KANEKA CORP (JP)
International Classes:
C08L101/06; C08K5/5373; C08L63/00; C08L101/08; H01B3/44; H05K3/28
Foreign References:
JP6263307B12018-01-17
JP2003267984A2003-09-25
JP2002003727A2002-01-09
JP2017137405A2017-08-10
JP2008299293A2008-12-11
Attorney, Agent or Firm:
SHINTAKU, Masato (JP)
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