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Patent Searching and Data


Title:
RESIN COMPOSITION, CURED FILM OF SAME AND METHOD FOR MANUFACTURING SAME, AND SOLID-STATE IMAGING ELEMENT
Document Type and Number:
WIPO Patent Application WO/2017/188047
Kind Code:
A1
Abstract:
A resin composition including a polysiloxane (A) and a solvent (B), wherein the polysiloxane (A) includes at least one partial structure represented by any of general formulas (1) through (3), and the relationship between the film thickness X after the resin composition is applied and dried for 3 minutes at 100°C and the film thickness Y after subsequent heating thereof for 5 minutes at 230°C satisfies the expression (X – Y)/X ≤ 0.05. This resin composition has excellent coating properties on uneven portions, and has excellent planarization performance even in a thin film thereof. (In the formulas, R1 represents a single bond or a C1-4 alkyl group, R2 represents a C1-4 alkyl group, and R3 represents an organic group.)

Inventors:
HIBINO TOSHIYASU (JP)
MATOBA YOSHINORI (JP)
SUWA MITSUHITO (JP)
Application Number:
PCT/JP2017/015480
Publication Date:
November 02, 2017
Filing Date:
April 17, 2017
Export Citation:
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Assignee:
TORAY INDUSTRIES (JP)
International Classes:
C08F299/08; C08G77/20; C08L83/07; G03F7/027; G03F7/075; H01L27/146
Domestic Patent References:
WO2015111607A12015-07-30
WO2010061744A12010-06-03
WO2013157643A12013-10-24
Foreign References:
JP2010031272A2010-02-12
JP2012041392A2012-03-01
JP2013155258A2013-08-15
JP2013130717A2013-07-04
JP2014082467A2014-05-08
JP2014237771A2014-12-18
JP2015068930A2015-04-13
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