Title:
RESIN COMPOSITION, CURED FILM, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/070387
Kind Code:
A1
Abstract:
A resin composition comprising at least a resin (A) and one or more compounds (B), wherein the compounds (B) are a compound represented by formula (1) and/or a compound represented by formula (2). (In formulae (1) and (2), R1 to R8 each independently represent a group selected from the group consisting of a hydrogen atom, alkoxy groups, a hydroxyl group, sulfonic acid groups, a thiol group, and C1-C20 organic groups.) The resin composition changes little in viscosity.
Inventors:
SUGISAKI YUMA (JP)
MURATA MASAYA (JP)
MURATA MASAYA (JP)
Application Number:
PCT/JP2023/030890
Publication Date:
April 04, 2024
Filing Date:
August 28, 2023
Export Citation:
Assignee:
TORAY INDUSTRIES (JP)
International Classes:
C08L101/00; C08K5/3415; C08K5/357; C08L79/04; C08L79/08
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