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Title:
RESIN COMPOSITION, CURED FILM THEREOF, SEMICONDUCTOR DEVICE EQUIPPED WITH SAME, AND METHOD FOR PRODUCING SEMICONDCUTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/082803
Kind Code:
A1
Abstract:
A siloxane resin composition that does not crack after high-temperature firing, the resin composition being characterized by being a resin composition including a filler and a polysiloxane and by including at least one selected from amine compounds, alkali metals, and alkaline earth metals and/or an organic compound that thermally decomposes at 500°C or higher inside the filler.

Inventors:
HAYASAKA, Makoto (Toray Industries Inc., 1-1, Sonoyama 1-chome, Otsu-sh, Shiga 58, 〒5208558, JP)
OKAZAWA, Toru (Toray Industries Inc., 1-1, Sonoyama 1-chome, Otsu-sh, Shiga 58, 〒5208558, JP)
FUJIWARA, Takenori (Toray Industries Inc., 1-1, Sonoyama 1-chome, Otsu-sh, Shiga 58, 〒5208558, JP)
Application Number:
JP2018/038980
Publication Date:
May 02, 2019
Filing Date:
October 19, 2018
Export Citation:
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Assignee:
TORAY INDUSTRIES, INC. (1-1 Nihonbashi-Muromachi 2-chome, Chuo-ku Tokyo, 66, 〒1038666, JP)
International Classes:
C08L83/04; C01B33/12; C08K9/00; H01L21/312
Foreign References:
JP2014072252A2014-04-21
JP2014168026A2014-09-11
JP2013122965A2013-06-20
JP2010186975A2010-08-26
JP2011181898A2011-09-15
JP2000049155A2000-02-18
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