Title:
RESIN COMPOSITION AND CURED MATERIAL OF SAME, ADHESIVE, SEMICONDUCTOR DEVICE, AND ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2019/151256
Kind Code:
A1
Abstract:
Provided are a resin composition and an adhesive including the same, a cured material of the resin composition and a semiconductor device including the same, and an electronic component including the semiconductor device, the resin composition being photocurable and heat curable and capable of low-temperature curing, and having high moisture-resistant reliability (particularly shear strength after moisture resistance testing) after curing. A resin composition characterized by including (A) a polyfunctional (meth)acrylate resin, (B) a polyfunctional thiol resin, and (C) a calcium carbonate filler having a purity of 99% or higher. The (B) component preferably includes a polyfunctional thiol resin not having an ester bond in the molecule thereof. More preferably, the resin composition further includes talc.
Inventors:
ABE NOBUYUKI (JP)
IWAYA KAZUKI (JP)
IWAYA KAZUKI (JP)
Application Number:
PCT/JP2019/002991
Publication Date:
August 08, 2019
Filing Date:
January 29, 2019
Export Citation:
Assignee:
NAMICS CORP (JP)
International Classes:
C08G75/045; C08K3/26; C08L81/02; C09J181/02
Domestic Patent References:
| WO2005052021A1 | 2005-06-09 | |||
| WO2005070991A1 | 2005-08-04 |
Foreign References:
| JPH1121352A | 1999-01-26 | |||
| JP2015517012A | 2015-06-18 | |||
| JP2016512278A | 2016-04-25 | |||
| CN107641200A | 2018-01-30 | |||
| JP2009051954A | 2009-03-12 | |||
| JP2014077024A | 2014-05-01 | |||
| JP2010117545A | 2010-05-27 | |||
| JP2008184514A | 2008-08-14 | |||
| JP2011026539A | 2011-02-10 | |||
| JP2002509178A | 2002-03-26 |
Other References:
See also references of EP 3747933A4
Attorney, Agent or Firm:
IAT WORLD PATENT LAW FIRM (JP)
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