RESIN COMPOSITION, CURED OBJECT, AND LAMINATE

Title:

RESIN COMPOSITION, CURED OBJECT, AND LAMINATE

Document Type and Number:

WIPO Patent Application WO/2020/059305

Kind Code:

A1

Abstract:

The present invention provides a resin composition comprising an epoxy compound A, which has a specific structure including an aromatic ring and has an epoxy equivalent in the range of 500-10,000 g/eq, and an epoxy compound B, which has an epoxy equivalent in the range of 100-300 g/eq, and an adhesive comprising the resin composition. The present invention further provides: a cured object characterized by comprising resin particles that are cured particles formed from an epoxy compound A, which has a specific structure including an aromatic ring and has an epoxy equivalent in the range of 500-10,000 g/eq, and a matrix resin that is a cured resin formed from an epoxy compound B, which has an epoxy equivalent in the range of 100-300 g/eq; and a laminate characterized by comprising a base and a layer of the cured object.

Inventors:

OTSU MASATO (JP)
ARITA KAZUO (JP)

Application Number:

PCT/JP2019/029769

Publication Date:

March 26, 2020

Filing Date:

July 30, 2019

Export Citation:

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Assignee:

DAINIPPON INK & CHEMICALS (JP)

International Classes:

C08L63/00; B32B27/38; C08G59/20

Domestic Patent References:

WO2013146478A1	2013-10-03
WO2019123941A1	2019-06-27
WO2019123943A1	2019-06-27

Foreign References:

JP2006335796A	2006-12-14
JP2013040271A	2013-02-28
JP2014177581A	2014-09-25
JP2014185271A	2014-10-02
JPH0853533A	1996-02-27
JP2006335796A	2006-12-14

Other References: