Title:
RESIN COMPOSITION, CURED OBJECT, PREPREG, METAL-FOIL-CLAD LAMINATE, RESIN SHEET, AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2023/026829
Kind Code:
A1
Abstract:
Provided are: a resin composition which, before moisture absorption (initial state) and after moisture absorption, is low in both permittivity and dielectric loss tangent and which is high in metal-foil peel strength; and a cured object, a prepreg, a metal-foil-clad laminate, a resin sheet, and a printed wiring board each obtained using the resin composition. The resin composition comprises a compound (A) represented by formula (M1) and a polymer (B) having a constituent unit represented by formula (V).
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Inventors:
NAKASHIMA YUJI (JP)
KOBAYASHI TAKASHI (JP)
HIRANO SHUNSUKE (JP)
HASEBE KEIICHI (JP)
KOBAYASHI TAKASHI (JP)
HIRANO SHUNSUKE (JP)
HASEBE KEIICHI (JP)
Application Number:
PCT/JP2022/030138
Publication Date:
March 02, 2023
Filing Date:
August 05, 2022
Export Citation:
Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
C08F299/00; B32B15/08; B32B27/34; C08J5/24; C08K5/3415; C08L25/00; H05K1/03
Domestic Patent References:
WO2020217675A1 | 2020-10-29 | |||
WO2020217674A1 | 2020-10-29 | |||
WO2020217677A1 | 2020-10-29 | |||
WO2020175538A1 | 2020-09-03 | |||
WO2022054867A1 | 2022-03-17 | |||
WO2020175537A1 | 2020-09-03 | |||
WO2017115813A1 | 2017-07-06 | |||
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Foreign References:
JP2019194307A | 2019-11-07 | |||
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Attorney, Agent or Firm:
SIKS & CO. (JP)
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