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Title:
RESIN COMPOSITION, CURED OBJECT, PREPREG, METAL-FOIL-CLAD LAMINATE, RESIN SHEET, AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2023/026829
Kind Code:
A1
Abstract:
Provided are: a resin composition which, before moisture absorption (initial state) and after moisture absorption, is low in both permittivity and dielectric loss tangent and which is high in metal-foil peel strength; and a cured object, a prepreg, a metal-foil-clad laminate, a resin sheet, and a printed wiring board each obtained using the resin composition. The resin composition comprises a compound (A) represented by formula (M1) and a polymer (B) having a constituent unit represented by formula (V).

Inventors:
NAKASHIMA YUJI (JP)
KOBAYASHI TAKASHI (JP)
HIRANO SHUNSUKE (JP)
HASEBE KEIICHI (JP)
Application Number:
PCT/JP2022/030138
Publication Date:
March 02, 2023
Filing Date:
August 05, 2022
Export Citation:
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Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
C08F299/00; B32B15/08; B32B27/34; C08J5/24; C08K5/3415; C08L25/00; H05K1/03
Domestic Patent References:
WO2020217675A12020-10-29
WO2020217674A12020-10-29
WO2020217677A12020-10-29
WO2020175538A12020-09-03
WO2022054867A12022-03-17
WO2020175537A12020-09-03
WO2017115813A12017-07-06
WO2017126469A12017-07-27
Foreign References:
JP2019194307A2019-11-07
JP2010138364A2010-06-24
JP2018039995A2018-03-15
JP2018168347A2018-11-01
JP2006070136A2006-03-16
JP2006089683A2006-04-06
JP2008248001A2008-10-16
JP2018016709A2018-02-01
JP2017119739A2017-07-06
JP2022054761A2022-04-07
JP2004277460A2004-10-07
JP2021021027A2021-02-18
Attorney, Agent or Firm:
SIKS & CO. (JP)
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