Title:
RESIN COMPOSITION, CURED OBJECT, PREPREG, METAL-FOIL-CLAD LAMINATE, RESIN COMPOSITE SHEET, PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/024664
Kind Code:
A1
Abstract:
Provided are: a resin composition comprising a heat-curable compound and a fluororesin filler and attaining low-dielectric properties and excellent moist heat resistance; and a cured object, a prepreg, a metal-foil-clad laminate, a resin composite sheet, a printed wiring board, and a semiconductor device. The resin composition comprises a fluororesin filler (A) having an acidic group and/or a basic group, a thermoplastic elastomer (B) having a basic group and/or an acidic group, which is opposite to the acidic group and/or the basic group of the fluororesin filler (A), and a heat-curable compound (C) compatible with the thermoplastic elastomer (B).
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Inventors:
KAMATA YUJI (JP)
HASEBE KEIICHI (JP)
HASEBE KEIICHI (JP)
Application Number:
PCT/JP2023/026752
Publication Date:
February 01, 2024
Filing Date:
July 21, 2023
Export Citation:
Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
C08L27/12; B32B15/08; C08J5/10; C08L21/00; H05K1/03
Domestic Patent References:
| WO2021157507A1 | 2021-08-12 | |||
| WO2021193196A1 | 2021-09-30 | |||
| WO2020158849A1 | 2020-08-06 |
Foreign References:
| JP2021143327A | 2021-09-24 | |||
| JP2020180245A | 2020-11-05 | |||
| JP2020100759A | 2020-07-02 | |||
| JP2020515701A | 2020-05-28 |
Attorney, Agent or Firm:
SIKS & CO. (JP)
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