Title:
RESIN COMPOSITION, CURED RESIN OBJECT, AND PRODUCT OBTAINED USING THESE
Document Type and Number:
WIPO Patent Application WO/2020/188853
Kind Code:
A1
Abstract:
A resin composition which comprises an epoxy resin having a mesogenic skeleton and an organic compound having a first functional group, which is capable of forming a crosslinked structure together with the epoxy resin or other organic compound, wherein the organic compound has a chemical structure that has, at a terminal thereof, a second functional group, which is capable of forming a covalent bond which reversibly undergoes cleavage and combining, or that has, in an inner portion thereof, a covalent bond which reversibly undergoes cleavage and combining, and the epoxy resin has a chemical structure capable of forming microdomains. The resin composition is cured to obtain a cured resin object. Due to this, it is possible to provide: a resin composition and a cured resin object which are excellent in terms of heat resistance, vibration-damping property, and production efficiency; and a product obtained using these.
Inventors:
KAGAWA HIROYUKI (JP)
TANAKA SHINGO (JP)
TANAKA SHINGO (JP)
Application Number:
PCT/JP2019/034205
Publication Date:
September 24, 2020
Filing Date:
August 30, 2019
Export Citation:
Assignee:
HITACHI LTD (JP)
International Classes:
C08G59/20; C08K5/09; C08K7/02; C08L63/00
Domestic Patent References:
| WO2002094905A1 | 2002-11-28 |
Foreign References:
| JPH09118673A | 1997-05-06 | |||
| JP2016008218A | 2016-01-18 | |||
| JP2011074366A | 2011-04-14 | |||
| JP2018162451A | 2018-10-18 |
Attorney, Agent or Firm:
POLAIRE I.P.C. (JP)
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