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Title:
RESIN COMPOSITION, CURED OBJECT, SHEET, LAYERED PRODUCT, AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2023/090363
Kind Code:
A1
Abstract:
A resin composition including a maleimide resin (A) obtained by reacting one or more tetracarboxylic dianhydrides (a1), diamines (a2), and maleic anhydride (a3), wherein the tetracarboxylic dianhydrides (a1) include at least one compound selected from among the compound represented by formula (1), the compound represented by formula (2), and the compound represented by formula (6) and the diamines (a2) comprise a dimer diamine and a second diamine, which is not a dimer diamine.

Inventors:
SATO KITARU (JP)
IMAI TETSUYA (JP)
Application Number:
PCT/JP2022/042567
Publication Date:
May 25, 2023
Filing Date:
November 16, 2022
Export Citation:
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Assignee:
RESONAC CORP (JP)
International Classes:
H05K1/03; B32B27/00; B32B27/34; C08F299/02; C08G73/12
Domestic Patent References:
WO2021182207A12021-09-16
WO2010053185A12010-05-14
Foreign References:
JP2019073689A2019-05-16
JP2013227405A2013-11-07
JP2021155717A2021-10-07
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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