Title:
RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING LAMINATE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/190061
Kind Code:
A1
Abstract:
Provided are: a resin composition including a polyimide precursor containing a repeating unit represented by formula (1) and a radical polymerizable compound, wherein ΔSP calculated by the following formula (S) is more than -3.5 MPa1/2 and less than 5.0 MPa1/2; a cured product; a laminate; a method for producing a cured product; a method for producing a laminate; a method for producing a semiconductor device; and a semiconductor device. Formula (S): ΔSP = (solubility parameter SPB of the radically polymerizable compound) - (solubility parameter SPA of the polyimide precursor).
Inventors:
OGAWA MICHIHIRO (JP)
NOZAKI ATSUYASU (JP)
NOZAKI ATSUYASU (JP)
Application Number:
PCT/JP2023/011590
Publication Date:
October 05, 2023
Filing Date:
March 23, 2023
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
C08F290/14; B32B15/088; B32B27/34; C08G73/10; G03F7/004; G03F7/027; G03F7/20
Domestic Patent References:
| WO2017110982A1 | 2017-06-29 | |||
| WO2014097594A1 | 2014-06-26 | |||
| WO2022045060A1 | 2022-03-03 | |||
| WO2020196363A1 | 2020-10-01 | |||
| WO2020195993A1 | 2020-10-01 | |||
| WO2021020344A1 | 2021-02-04 |
Foreign References:
| JP6271105B1 | 2018-01-31 | |||
| JP2021173787A | 2021-11-01 | |||
| JP2021120703A | 2021-08-19 | |||
| JPH0836264A | 1996-02-06 | |||
| JPH06342211A | 1994-12-13 | |||
| JPS62290726A | 1987-12-17 |
Attorney, Agent or Firm:
SIKs & Co. (JP)
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