Title:
RESIN COMPOSITION, CURED PRODUCT, LAMINATE, CURED PRODUCT MANUFACTURING METHOD, LAMINATE MANUFACTURING METHOD, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, SEMICONDUCTOR DEVICE, RESIN FILM, AND COMPOUND
Document Type and Number:
WIPO Patent Application WO/2024/024833
Kind Code:
A1
Abstract:
Provided are: a resin composition containing a cyclized resin precursor and a compound B in which the thermal decomposition start temperature at which an amine is generated is equal to or less than 200°C, as measured by means of the simultaneous thermogravimetry/differential thermal analysis, and that is represented by formula (1-1); a cured product; a laminate; a cured product manufacturing method; a laminate manufacturing method; a semiconductor device manufacturing method; and a semiconductor device. In formula (1―1), R1a represents a hydrogen atom or a monovalent organic group; R2a represents a monovalent organic group; R3a represents a hydrogen atom or a monovalent organic group; R4a represents a monovalent organic group; R1a and R2a may form a cyclic structure by being bonded to each other; and R3a and R4a may form a cyclic structure by being bonded to each other.
Inventors:
OGAWA MICHIHIRO (JP)
NOZAKI ATSUYASU (JP)
NOZAKI ATSUYASU (JP)
Application Number:
PCT/JP2023/027369
Publication Date:
February 01, 2024
Filing Date:
July 26, 2023
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
C08L101/02; B32B27/00; C07D215/06; C07D223/22; C07D241/42; C07D265/38; C07D303/24; C07D305/06; C07D495/04; C08K5/21; C08L79/08; G03F7/004; G03F7/038; G03F7/20
Domestic Patent References:
| WO2022145355A1 | 2022-07-07 | |||
| WO2022145356A1 | 2022-07-07 | |||
| WO2021172421A1 | 2021-09-02 | |||
| WO2021246459A1 | 2021-12-09 | |||
| WO2022138606A1 | 2022-06-30 |
Foreign References:
| JPH05301959A | 1993-11-16 |
Attorney, Agent or Firm:
SIKS & CO. (JP)
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