RESIN COMPOSITION, CURED PRODUCT, LAYERED PRODUCT, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING LAYERED PRODUCT, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE

WIPO Patent Application WO/2023/189126

A1

Provided are: a resin composition able to yield a cured product having excellent resistance to wet heat; a cured product obtained by curing the resin composition; a layered product that includes the cured product; a method for producing a cured product; a method for producing a layered product; a method for producing a semiconductor device, which includes the method for producing a layered product; and a semiconductor device that includes a cured product or a layered product.　This resin composition contains: a polyimide precursor that contains repeating units represented by formula (1); and a compound B which has a monovalent organic group represented by formula (R-1) or formula (R-2) and an aromatic 5-membered ring structure that includes two or more nitrogen atoms as ring members, which may have a ring structure fused to the aromatic 5-membered ring structure, and in which the monovalent organic group is directly bonded to the aromatic 5-membered ring structure or the fused ring structure. The solubility parameter of the compound B is 10-30 MPa1/2.

OGAWA MICHIHIRO (JP)
NOZAKI ATSUYASU (JP)

PCT/JP2023/007449

October 05, 2023

March 01, 2023

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FUJIFILM CORP (JP)

C08L79/08; B32B15/088; C08F290/14; C08K5/3445; C08K5/3472; G03F7/027; G03F7/20

WO2021246457A1	2021-12-09
WO2022050278A1	2022-03-10
WO2022138606A1	2022-06-30

JP2023023170A

2023-02-16

TAIYO, NAKAJIMA & KATO (JP)

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