Title:
RESIN COMPOSITION, CURED PRODUCT, MULTILAYER BODY, METHOD FOR PRODUCING CURED PRODUCT, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/210233
Kind Code:
A1
Abstract:
The present invention provides: a resin composition which contains a nonionic base generator that generates a base having a pyridine structure by the action of light or heat, a precursor of a cyclized resin and a photopolymerization initiator or a photoacid generator; a cured product which is obtained by curing this resin composition; a multilayer body which contains this cured product; a method for producing this cured product; and a semiconductor device which comprises this cured product or this multilayer body.
Inventors:
ASAKAWA DAISUKE (JP)
Application Number:
PCT/JP2022/013817
Publication Date:
October 06, 2022
Filing Date:
March 24, 2022
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
B32B27/16; B32B15/08; C08K5/103; C08K5/3432; C08K5/375; C08L79/08; G03F7/004; G03F7/027; G03F7/039; G03F7/20; G03F7/40; H05K1/03
Domestic Patent References:
| WO2019168089A1 | 2019-09-06 | |||
| WO2018038001A1 | 2018-03-01 |
Foreign References:
| JP2001330950A | 2001-11-30 | |||
| JP2013241548A | 2013-12-05 | |||
| JP2010090386A | 2010-04-22 |
Attorney, Agent or Firm:
SIKs & Co. (JP)
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