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Patent Searching and Data


Title:
RESIN COMPOSITION, CURED PRODUCT, PATTERN CURED PRODUCT, CURED PRODUCT PRODUCTION METHOD, INTERLAYER INSULATING FILM, SURFACE PROTECTION FILM AND ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2018/155639
Kind Code:
A1
Abstract:
This resin composition contains: (a) a polyimide or polyimide precursor; (d1) a compound represented by formula (11) or (12); and (d2) one or more compounds selected from the group consisting of a compound represented by formula (13), a compound represented by formula (14), a compound represented by formula (15), and a compound represented by formula (16).

Inventors:
SAITO NOBUYUKI (JP)
KOIBUCHI YUKARI (JP)
NAMATAME YUTAKA (JP)
Application Number:
PCT/JP2018/006741
Publication Date:
August 30, 2018
Filing Date:
February 23, 2018
Export Citation:
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Assignee:
HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD (JP)
International Classes:
C08F2/44; C08G73/10; G03F7/027; G03F7/031; G03F7/40
Domestic Patent References:
WO2015116657A12015-08-06
WO2015052885A12015-04-16
Foreign References:
US20160313641A12016-10-27
JPH05216224A1993-08-27
JPH0611830A1994-01-21
JP2004029702A2004-01-29
JP2000098604A2000-04-07
JP2000098607A2000-04-07
JP2001005182A2001-01-12
JP2001005180A2001-01-12
JPH03220558A1991-09-27
Attorney, Agent or Firm:
HEIWA INTERNATIONAL PATENT OFFICE (JP)
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