Title:
RESIN COMPOSITION, CURED PRODUCT, SEALING FILM, AND SEALING STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2017/038941
Kind Code:
A1
Abstract:
Provided is a resin composition containing a thermosetting component and an inorganic filler, wherein the inorganic filler includes aluminum oxide, and the content of the inorganic filler is at least 72 mass%, the total mass of the resin composition (excluding the mass of a solvent) serving as a reference.
Inventors:
WATASE YUSUKE (JP)
FUJIMOTO DAISUKE (JP)
NOMURA YUTAKA (JP)
OGIHARA HIROKUNI (JP)
KANEKO TOMOYO (JP)
TOBA MASAYA (JP)
SUZUKI MASAHIKO (JP)
FUJIMOTO DAISUKE (JP)
NOMURA YUTAKA (JP)
OGIHARA HIROKUNI (JP)
KANEKO TOMOYO (JP)
TOBA MASAYA (JP)
SUZUKI MASAHIKO (JP)
Application Number:
PCT/JP2016/075688
Publication Date:
March 09, 2017
Filing Date:
September 01, 2016
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
H01L23/29; C08G59/42; C08J5/18; C08K3/22; C08K5/3445; C08L61/06; C08L63/00; H01L23/31
Domestic Patent References:
| WO2015098838A1 | 2015-07-02 |
Foreign References:
| JP2015106698A | 2015-06-08 | |||
| JP2014029958A | 2014-02-13 | |||
| JP2012025907A | 2012-02-09 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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