Title:
RESIN COMPOSITION, CURED PRODUCT OF RESIN COMPOSITION, SEMICONDUCTOR DEVICE, AND ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2024/048156
Kind Code:
A1
Abstract:
The present invention provides: a resin composition which is curable at a relatively low temperature and which has a long pot life; a cured product; and a semiconductor device and an electronic component which include the cured product. Provided are: a resin composition comprising (A) a radically polymerizable curable resin, (B) an organic peroxide, and (C) a polymerization inhibitor that can be sublimated, said resin composition further comprising (D) conductive particles as necessary; a cured product obtained by curing the resin composition; and a semiconductor device and an electronic component which comprise the cured product.
Inventors:
OTOMO MASAYOSHI (JP)
Application Number:
PCT/JP2023/027728
Publication Date:
March 07, 2024
Filing Date:
July 28, 2023
Export Citation:
Assignee:
NAMICS CORP (JP)
International Classes:
C08L101/02; C08F20/18; C08F290/06; C08K3/01; C08K5/08; C08K5/14; C08K5/3415; H01L21/52; C09J4/02; C09J9/02
Domestic Patent References:
| WO2021127128A1 | 2021-06-24 | |||
| WO2020090757A1 | 2020-05-07 |
Foreign References:
| JP2018187862A | 2018-11-29 | |||
| JP2016500741A | 2016-01-14 | |||
| JP2006328211A | 2006-12-07 |
Attorney, Agent or Firm:
ICHIZAWA, KAWADA & ASSOCIATES (JP)
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