RESIN COMPOSITION, CURED PRODUCT THEREOF, LAMINATE USING SAME, ELECTROSTATIC CHUCK, AND PLASMA PROCESSING DEVICE

Title:

RESIN COMPOSITION, CURED PRODUCT THEREOF, LAMINATE USING SAME, ELECTROSTATIC CHUCK, AND PLASMA PROCESSING DEVICE

Document Type and Number:

WIPO Patent Application WO/2023/068044

Kind Code:

A1

Abstract:

The present invention addresses the problem of providing a thermally conductive sheet that has a high thermal conductivity, a low elastic modulus in a low temperature range of -30°C or lower, and excellent adhesive strength. The main objective of the present invention is to obtain a thermally conductive sheet by using a resin composition containing: (A) a polyimide resin comprising a siloxane skeleton; (B) an epoxy resin; (C) a siloxane diamine; and (D) a thermally conductive filler.

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Inventors:

SHIMADA AKIRA (JP)
KIGUCHI KAZUYA (JP)
SAKABE YOHEI (JP)

Application Number:

PCT/JP2022/037230

Publication Date:

April 27, 2023

Filing Date:

October 05, 2022

Export Citation:

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Assignee:

TORAY INDUSTRIES (JP)

International Classes:

C08L79/08; C08G59/50; C08K3/013; C08K5/544; C08L63/00; C08L83/04; H01L21/3065

Domestic Patent References:

WO2021192935A1

2021-09-30

Foreign References:

JP2021091783A	2021-06-17
JPH10298536A	1998-11-10
JP2018131590A	2018-08-23
JP2014024927A	2014-02-06
JP2011123277A	2011-06-23

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