Title:
RESIN COMPOSITION, CURED RELIEF PATTERN THEREOF, AND METHOD FOR MANUFACTURING SEMICONDUCTOR ELECTRONIC COMPONENT OR SEMICONDUCTOR DEVICE USING SAME
Document Type and Number:
WIPO Patent Application WO/2017/169009
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a resin composition whereby surface roughness in a thin-film formation part can be suppressed and insulation reliability of the thin-film formation part can be maintained, a cured relief pattern of the resin composition, and a method for manufacturing a semiconductor electronic component or semiconductor device using the same. The present invention for achieving the above purpose is configured as follows. Specifically, the present invention is a resin composition containing (a) at least one type of resin selected from an alkali-soluble polyimide, an alkali-soluble polybenzoxazole, an alkali-soluble polyamide imide, and precursors thereof and copolymers thereof, and (b) an alkali-soluble phenol resin, the ratio (Rb/Ra) of the alkali solution velocity (Ra) of the (a) resin and the alkali solution velocity (Rb) of the (b) resin satisfying the relationship 0.5 ≤ Rb/Ra ≤ 2.0. The present invention is also a cured relief pattern of the resin composition, and a method for manufacturing a semiconductor element component or a semiconductor device using the same.
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Inventors:
BABA OSAMU (JP)
HAYASAKA MAKOTO (JP)
OKUDA RYOJI (JP)
HAYASAKA MAKOTO (JP)
OKUDA RYOJI (JP)
Application Number:
PCT/JP2017/002286
Publication Date:
October 05, 2017
Filing Date:
January 24, 2017
Export Citation:
Assignee:
TORAY INDUSTRIES (JP)
International Classes:
C08L79/08; C08K5/28; C08L25/18; C08L61/06; C08L79/04; G03F7/023; G03F7/20; H01L21/312
Domestic Patent References:
| WO2014069091A1 | 2014-05-08 |
Foreign References:
| JP2004334089A | 2004-11-25 | |||
| JP2007114763A | 2007-05-10 | |||
| JP2014137523A | 2014-07-28 | |||
| JP2014181311A | 2014-09-29 | |||
| JP2007025354A | 2007-02-01 | |||
| JPH08507093A | 1996-07-30 | |||
| JPH04209839A | 1992-07-31 |
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