Title:
RESIN COMPOSITION FOR DAMPING MATERIAL
Document Type and Number:
WIPO Patent Application WO/2024/058241
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a resin composition which is for a damping material and has excellent low-temperature drying properties and coating film stability. The present invention pertains to a resin composition for a damping material, the resin composition containing polymer emulsion particles and having multiple peaks in a particle size distribution measured using a dynamic light scattering particle size distribution analyzer.
Inventors:
KATAKURA NAOKI (JP)
Application Number:
PCT/JP2023/033489
Publication Date:
March 21, 2024
Filing Date:
September 14, 2023
Export Citation:
Assignee:
NIPPON CATALYTIC CHEM IND (JP)
International Classes:
C08K5/11; C08L71/00; C08L101/00; C09K3/00; F16F15/02
Domestic Patent References:
| WO2016159047A1 | 2016-10-06 | |||
| WO2007023821A1 | 2007-03-01 |
Foreign References:
| JP2009270064A | 2009-11-19 | |||
| JP2011057829A | 2011-03-24 | |||
| JP2011231184A | 2011-11-17 | |||
| JP2004277536A | 2004-10-07 | |||
| JP2008133357A | 2008-06-12 | |||
| JP2005029705A | 2005-02-03 | |||
| JPH083249A | 1996-01-09 |
Attorney, Agent or Firm:
WISEPLUS IP FIRM (JP)
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