Title:
RESIN COMPOSITION FOR DICING PROTECTION LAYER AND TREATMENT METHOD FOR SEMICONDUCTOR WAFER
Document Type and Number:
WIPO Patent Application WO/2023/002846
Kind Code:
A1
Abstract:
One aspect of the present disclosure relates to a resin composition for a dicing protection layer, the resin composition containing an organic solvent and an acrylic resin having a carboxy group.
Inventors:
MAKINO TATSUYA (JP)
Application Number:
PCT/JP2022/026756
Publication Date:
January 26, 2023
Filing Date:
July 05, 2022
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
H01L21/301; C08K5/10; C08L33/02; C08L33/06
Foreign References:
| JP2021077768A | 2021-05-20 | |||
| JP2001023935A | 2001-01-26 | |||
| JP2014172932A | 2014-09-22 | |||
| JP2014172932A | 2014-09-22 | |||
| JP2018129365A | 2018-08-16 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Download PDF:
Previous Patent: ELECTRONIC DEVICE AND CONTROL METHOD THEREFOR
Next Patent: OIL DISPERSION COMPOSITION
Next Patent: OIL DISPERSION COMPOSITION