Title:
RESIN COMPOSITION FOR DISPLAY SUBSTRATE, AND HEAT-RESISTANT RESIN FILM, ORGANIC EL DISPLAY SUBSTRATE, AND METHOD FOR MANUFACTURING ORGANIC EL DISPLAY USING SAME
Document Type and Number:
WIPO Patent Application WO/2017/068936
Kind Code:
A1
Abstract:
A resin composition for a display substrate, the resin composition including a solvent and a heat-resistant resin or a precursor thereof, wherein the solvent has as a main component an amide compound having a surface tension of 35 mN/m or less at 25°C. Provided is a resin composition for a display substrate, whereby pinholing of a thin film is not prone to occur.
Inventors:
ASHIBE TOMOKI (JP)
MIYAZAKI DAICHI (JP)
UEOKA KOJI (JP)
SAEKI AKINORI (JP)
NISHIYAMA MASAHITO (JP)
MIYAZAKI DAICHI (JP)
UEOKA KOJI (JP)
SAEKI AKINORI (JP)
NISHIYAMA MASAHITO (JP)
Application Number:
PCT/JP2016/079059
Publication Date:
April 27, 2017
Filing Date:
September 30, 2016
Export Citation:
Assignee:
TORAY INDUSTRIES (JP)
International Classes:
C08L101/00; C08K5/20; C08K5/54; C08L79/08; H01L51/50; H05B33/04; H05B33/10
Domestic Patent References:
| WO2013125194A1 | 2013-08-29 | |||
| WO2013133168A1 | 2013-09-12 | |||
| WO2015186782A1 | 2015-12-10 |
Foreign References:
| JP2015151515A | 2015-08-24 |
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