Title:
RESIN COMPOSITION FOR ELECTRIC INSULATION, CURED PRODUCT THEREOF, METHODS FOR MANUFACTURING SAME, AND HIGH-VOLTAGE DEVICES AND ELECTRIC POWER TRANSMISSION AND DISTRIBUTION DEVICES USING SAME
Document Type and Number:
WIPO Patent Application WO/2013/121571
Kind Code:
A1
Abstract:
In order to improve the dispersibility of a filler to thereby maintain uniform low thermal expansibility and mechanical strength, and improve the insulating property and particularly treeing-resisting property of a resin composition or a cured resin product to thereby improve the reliability of a high-voltage device, an electric power transmission and distribution device, and the like to which the resin composition or the cured resin product is applied.
A resin composition for electric insulation includes insulating resin (1) that is a base material, a large particle size filler (2), and a small particle size filler (3) having a smaller particle size than the large particle size filler (2), and the large particle size filler (2) and the small particle size filler (3) are dispersed in the insulating resin (1). The insulating resin (1) and the large particle size filler (2) have an affinity for each other, and the insulating resin (1) and the small particle size filler (3) have no affinity for each other.
Inventors:
MATSUMOTO HIRONORI (JP)
OHTAKE ATSUSHI (JP)
SANO AKIHIRO (JP)
OHTAKE ATSUSHI (JP)
SANO AKIHIRO (JP)
Application Number:
PCT/JP2012/053739
Publication Date:
August 22, 2013
Filing Date:
February 17, 2012
Export Citation:
Assignee:
HITACHI LTD (JP)
MATSUMOTO HIRONORI (JP)
OHTAKE ATSUSHI (JP)
SANO AKIHIRO (JP)
MATSUMOTO HIRONORI (JP)
OHTAKE ATSUSHI (JP)
SANO AKIHIRO (JP)
International Classes:
C08K3/36; H01B3/40; C08L53/02
Foreign References:
| JP2002015621A | 2002-01-18 | |||
| JP2008075069A | 2008-04-03 | |||
| JP2009096919A | 2009-05-07 | |||
| JP2011079954A | 2011-04-21 | |||
| JP2011001424A | 2011-01-06 | |||
| JP2009099387A | 2009-05-07 | |||
| JP2008075069A | 2008-04-03 |
Other References:
SANO ET AL.: "Development of Simulation Techniques for Strength of Nanocomposite Materials", A COLLECTION OF PAPERS FOR 2011 NATIONAL MEETING OF THE INSTITUTE OF ELECTRICAL ENGINEERS OF JAPAN
See also references of EP 2816568A4
See also references of EP 2816568A4
Attorney, Agent or Firm:
POLAIRE I. P. C. (JP)
Polaire Intellectual Property Corporation (JP)
Polaire Intellectual Property Corporation (JP)
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Claims:
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