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Patent Searching and Data


Title:
RESIN COMPOSITION, ELECTRICAL DEVICE, AND METHOD FOR PRODUCING RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2021/029108
Kind Code:
A1
Abstract:
In the present invention, higher pressure resistance is achieved in a resin composition used for electrical insulation and in an electrical device obtained using the resin composition. A resin composition 10 contains a base polymer 11 and an additive. The additive includes boron nitride 12 and elastic members 13. The boron nitride 12 is constituted from primary particles of hexagonal boron nitride having an aspect ratio of 2 or more. The elastic members 13 are constituted from elastic particles each having a core layer and a shell layer disposed around the periphery of the core layer. The elastic modulus of the core layer is different from the elastic modulus of the shell layer. The particle diameter of the elastic particles is smaller than the particle diameter of the primary particles of hexagonal boron nitride.

Inventors:
KOBAYASHI KINYA (JP)
AMOU SATORU (JP)
Application Number:
PCT/JP2020/015650
Publication Date:
February 18, 2021
Filing Date:
April 07, 2020
Export Citation:
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Assignee:
HITACHI INDUSTRY EQUIPMENT SYSTEMS CO LTD (JP)
International Classes:
C08G59/00; C08K3/34; C08K3/36; C08K3/38; C08L51/04; C08L63/00; C08L101/00
Domestic Patent References:
WO2017006893A12017-01-12
WO2018030124A12018-02-15
Foreign References:
CN108264735A2018-07-10
JP2016023290A2016-02-08
JP2015117324A2015-06-25
JP2019048952A2019-03-28
JP2016008280A2016-01-18
JP2014156514A2014-08-28
JPH09221573A1997-08-26
JP2020045417A2020-03-26
Attorney, Agent or Firm:
TSUTSUI & ASSOCIATES (JP)
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