Title:
RESIN COMPOSITION, ELECTROCONDUCTIVE ADHESIVE, CURED OBJECT, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/196328
Kind Code:
A1
Abstract:
Provided are: a resin composition which has a low modulus, can cure at low temperatures, and has a long pot-life and which is useful as electroconductive adhesives, materials for mounting components, sealants for protecting components, and insulating materials for reinforcement, for use in the field of flexible hybrid electronics (FHE); an electroconductive adhesive comprising the resin composition; a cured object formed from the resin composition; and a semiconductor device including a cued object formed from the electroconductive adhesive or resin composition. The resin composition comprises (A) a radical-polymerizable curable resin, (B) a free-radical polymerization initiator, and (C) a radical polymerization inhibitor, wherein the (C) component comprises (C1) a nitrosoamine compound and the (A) component comprises (A1) a urethane acrylate oligomer, the (A1) component having a mass-average molecular weight of 1,600-20,000.
Inventors:
OTOMO MASAYOSHI (JP)
Application Number:
PCT/JP2022/008381
Publication Date:
September 22, 2022
Filing Date:
February 28, 2022
Export Citation:
Assignee:
NAMICS CORP (JP)
International Classes:
C08F290/06; C09J4/02; C09J9/02; C09J11/06; H01B1/22
Domestic Patent References:
| WO2019177134A1 | 2019-09-19 | |||
| WO2017104318A1 | 2017-06-22 | |||
| WO2018159236A1 | 2018-09-07 | |||
| WO2020040052A1 | 2020-02-27 |
Foreign References:
| JP2018080129A | 2018-05-24 | |||
| JP2017101112A | 2017-06-08 | |||
| JP2018193453A | 2018-12-06 | |||
| JP2014240464A | 2014-12-25 |
Attorney, Agent or Firm:
IAT WORLD PATENT LAW FIRM (JP)
Download PDF:
Previous Patent: DECORATIVE MATERIAL, DECORATIVE PANEL, ELECTRONIC DEVICE, AND METHOD FOR PRODUCING DECORATIVE MATERI...
Next Patent: SWITCH DEVICE
Next Patent: SWITCH DEVICE