Title:
RESIN COMPOSITION AND ELECTRONIC COMPONENT DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/123745
Kind Code:
A1
Abstract:
Provided is a resin composition comprising a resin and an inorganic filler, wherein the inorganic filler contains inorganic particles having an average particle diameter of 0.07 to 0.5 µm.
Inventors:
KAN DONCHORU (JP)
HORI KEICHI (JP)
YAMAURA MASASHI (JP)
TANAKA MIKA (JP)
HORI KEICHI (JP)
YAMAURA MASASHI (JP)
TANAKA MIKA (JP)
Application Number:
PCT/JP2017/045605
Publication Date:
July 05, 2018
Filing Date:
December 19, 2017
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
C08K3/00; C08L101/00; C08K3/22; C08L63/00; H01L23/29; H01L23/31
Domestic Patent References:
| WO2013069782A1 | 2013-05-16 |
Foreign References:
| JPH07216197A | 1995-08-15 | |||
| JP2013014671A | 2013-01-24 | |||
| JP2002097254A | 2002-04-02 | |||
| JPH1192624A | 1999-04-06 |
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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