RESIN COMPOSITION FOR ELECTRONIC PARTS

Title:

RESIN COMPOSITION FOR ELECTRONIC PARTS

Document Type and Number:

WIPO Patent Application WO/1994/017140

Kind Code:

A1

Abstract:

The invention aims at providing a resin composition for electronic parts which is in great demand as a circuit board material for electric and electronic equipments, and which has a low dielectric constant, low dielectric dissipation factor and a thermal resistance. This resin consists of a thermoplastic resin or a thermosetting resin, and wollastonite or zonotolite, fibrous material containing CaO.SiO2 as a main component, mixed as reinforcing fiber with the resin at a mixing ratio of 5-60 % based on the total weight of the resin and fiber.

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Inventors:

TASAKA TAKIO (JP)
MONDE HIROYUKI (JP)

Application Number:

PCT/JP1994/000113

Publication Date:

August 04, 1994

Filing Date:

January 27, 1994

Export Citation:

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Assignee:

OTSUKA KAGAKU KK (JP)
TASAKA TAKIO (JP)
MONDE HIROYUKI (JP)

International Classes:

C08K7/08; C08K7/10; H05K1/03; (IPC1-7): C08L101/00; C08K7/04

Foreign References:

JPH0255761A	1990-02-26
JPH02166134A	1990-06-26
JPH01210452A	1989-08-24

Other References: