RESIN COMPOSITION FOR ENCAPSULATING FILM OF PHOTOVOLTAIC MODULE AND PHOTOVOLTAIC MODULE USING THE SAME

Title:

RESIN COMPOSITION FOR ENCAPSULATING FILM OF PHOTOVOLTAIC MODULE AND PHOTOVOLTAIC MODULE USING THE SAME

Document Type and Number:

WIPO Patent Application WO/2013/058525

Kind Code:

A1

Abstract:

Provided are a resin composition for an encapsulating film of a photovoltaic module, and a photovoltaic module using the same, and more particularly, a resin composition for an encapsulating film of a photovoltaic module, having low moisture permeability and excellent adhesiveness due to thermal compression, and a photovoltaic module using the same, and thus, in the case where the resin composition for an encapsulating film of a photovoltaic module is used for a front sheet, a back sheet, or both of the front and back sheets, of a photovoltaic module, the resin composition can be used without an adhesive due to excellent transparency and durability against ultraviolet light and high adhesive strength with respect to glass, and thus can exhibit excellent compatibility.

Inventors:

HONG SEUNG GWEON (KR)
JEON MIN HO (KR)
CHUNG KWANG JIN (KR)
CHUNG KI NAM (KR)
OK MYUNG AHN (KR)
SON IN HUN (KR)

Application Number:

PCT/KR2012/008449

Publication Date:

April 25, 2013

Filing Date:

October 17, 2012

Export Citation:

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Assignee:

SK INNOVATION CO LTD (KR)
SK GLOBAL CHEMICAL CO LTD (KR)

International Classes:

C08L69/00; C08G64/02; C08G64/34; H01L31/042

Foreign References:

US20090234042A1	2009-09-17
US20110054145A1	2011-03-03
US20110207899A1	2011-08-25
US20070295389A1	2007-12-27
EP2351783A1	2011-08-03

Other References: